SOLDER TUB AND SOLDERING EQUIPMENT

PROBLEM TO BE SOLVED: To provide a solder tub and soldering equipment that excel in corrosion resistance against fused solder more than conventional ones. SOLUTION: The solder tub includes a metallic container for storing fused solder and an amorphous carbon film which is formed on the inner face of...

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Bibliographische Detailangaben
Hauptverfasser: YOSHIOKA TAKAYASU, TACHIKAWA HIDEO, HASEGAWA HIDEO, KAJINO MASAKI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a solder tub and soldering equipment that excel in corrosion resistance against fused solder more than conventional ones. SOLUTION: The solder tub includes a metallic container for storing fused solder and an amorphous carbon film which is formed on the inner face of the container and which contains one or more kinds of elements to be added selectable from semiconductors and metals. Also, the soldering equipment is at least provided with the solder tub and a holding means that holds a member to be soldered and that moves it so that its part to be soldered is immersed in the fused solder stored in the container. The solder tub and the soldering equipment have the amorphous carbon film containing the additional element(s) on the surface of the container as a corrosion resistant film that comes in contact with the fused solder, and particularly have a superior corrosion resistance against lead-free solder. COPYRIGHT: (C)2008,JPO&INPIT