THIN-FILM DEVICE

PROBLEM TO BE SOLVED: To provide a thin-film device capable of improving the inductance, when the device is provided with a thin-film coil wound around a magnetic film. SOLUTION: In a solenoid type thin-film coil 14 wound around the upper magnetic film 13, the thickness TA of a lower coil 14A (14A1-14A5), sandwiched by a lower magnetic film 12 and an upper magnetic film 13, is smaller than the thickness TB of the upper coil 14B (14B1-14B4) that is not sandwiched by the lower magnetic film 12 and the upper magnetic film 13 (thickness ratio TB/TA>1). Thus, leakage magnetic flux quantity J is small between the lower magnetic film 12 and the upper magnetic film 13 than that when the thickness TA of the lower coil 14A is not smaller than the thickness TB of the upper coil 14B (thickness ratio TB/TA≤1). COPYRIGHT: (C)2008,JPO&INPIT