RADIATION-CURABLE LIQUID RESIN COMPOSITION FOR ADHESIVE USE AND BONDING METHOD USING THE SAME

PROBLEM TO BE SOLVED: To provide a radiation-curable liquid resin composition for adhesive use, high in resin-resin bonding ability and slight in the decline in adhesive force even if exposed to a high-temperature and high-humidity ambience. SOLUTION: The radiation-curable liquid resin composition f...

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Bibliographische Detailangaben
Hauptverfasser:	KUROSAWA TAKAHIKO, TONSHO SHINJI, SUGIMOTO MASANOBU
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a radiation-curable liquid resin composition for adhesive use, high in resin-resin bonding ability and slight in the decline in adhesive force even if exposed to a high-temperature and high-humidity ambience. SOLUTION: The radiation-curable liquid resin composition for adhesive use comprises, based on total 100 mass%: (A) 10-45 mass% of a polar group-containing radical-polymerizable compound 1,000 or less in molecular weight; (B) 50-85 mass% of a polar group-free radical-polymerizable compound 1,000 or less in molecular weight; and (C) 0.1-10 mass% of a photopolymerization initiator. This resin composition gives a cured product with a glass transition point of 70°C or higher. COPYRIGHT: (C)2008,JPO&INPIT