CMP PAD CONDITIONER

PROBLEM TO BE SOLVED: To provide a CMP pad conditioner capable of grinding a polishing pad safely and flatly. SOLUTION: A grinding part 2 is formed so that abrasive grains 4 are secured to a base metal 3 by means of blazing. The base metal 3 is composed of a flat part 3a positioned nearer the inside...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TOGE NAOKI, NONOSHITA TETSUYA
Format:	Patent
Sprache:	eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING
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