DEVICE AND METHOD FOR EVALUATING LOOP FALL IN BONDING WIRE

PROBLEM TO BE SOLVED: To provide a device for evaluating a loop fall in bonding wire, capable of solving a problem in conventional evaluation technique that much time and costs are required when a large amount of samples are picked up as objects to be evaluated and efficiently evaluating a large amo...

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1. Verfasser:	TAKAMORI MASAHITO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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creator	TAKAMORI MASAHITO
description	PROBLEM TO BE SOLVED: To provide a device for evaluating a loop fall in bonding wire, capable of solving a problem in conventional evaluation technique that much time and costs are required when a large amount of samples are picked up as objects to be evaluated and efficiently evaluating a large amount of objects to be measured with less human errors, and to provide its evaluation method. SOLUTION: The loop fall is evaluated by positioning a plurality of contact type probes between the adjacent loops of the bonding wire wired substantially in parallel, and then, performing linear scanning along the loops so as to detect existence of contact between the contact type probe and the loop by electric conduction. COPYRIGHT: (C)2007,JPO&INPIT
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SOLUTION: The loop fall is evaluated by positioning a plurality of contact type probes between the adjacent loops of the bonding wire wired substantially in parallel, and then, performing linear scanning along the loops so as to detect existence of contact between the contact type probe and the loop by electric conduction. 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SOLUTION: The loop fall is evaluated by positioning a plurality of contact type probes between the adjacent loops of the bonding wire wired substantially in parallel, and then, performing linear scanning along the loops so as to detect existence of contact between the contact type probe and the loop by electric conduction. 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SOLUTION: The loop fall is evaluated by positioning a plurality of contact type probes between the adjacent loops of the bonding wire wired substantially in parallel, and then, performing linear scanning along the loops so as to detect existence of contact between the contact type probe and the loop by electric conduction. COPYRIGHT: (C)2007,JPO&INPIT</abstract><oa>free_for_read</oa></addata></record>
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title	DEVICE AND METHOD FOR EVALUATING LOOP FALL IN BONDING WIRE
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