ELECTROLESS PLATING LIQUID AND ELECTROLESS PLATING METHOD

PROBLEM TO BE SOLVED: To provide an electroless plating liquid in which any poisonous chemicals such as cyan compounds, thallium compounds and hydrazine are not used, and impurities such as phosphor or boron are not contained in a nickel base plating layer, and an electroless plating method. SOLUTIO...

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Bibliographische Detailangaben
Hauptverfasser:	STRUKOV GENNADIJ VASILEVICH, KEDROV VIKTOR VIKTOROVICH, STRUKOVA GALINA KUZMINICHNA, SHIMATANI HIROYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an electroless plating liquid in which any poisonous chemicals such as cyan compounds, thallium compounds and hydrazine are not used, and impurities such as phosphor or boron are not contained in a nickel base plating layer, and an electroless plating method. SOLUTION: The electroless plating liquid is obtained by using sulfoxide, more specifically, sulfoxide having a chemical structure : R1-S(=O)-R2(where R1and R2denote alkyl groups of n = 1 to 3), or by using tetra-methylene-sulfoxide (chemical formula : C4H8SO), and adding any of a halide, a nitrate, an acetate, and a citrate of a plating metal. COPYRIGHT: (C)2007,JPO&INPIT