METHOD FOR PRODUCING ELECTRONIC CIRCUIT BOARD AND DEVICE THEREFOR
PROBLEM TO BE SOLVED: To carry an electronic circuit board without generating sagging, tightening, wrinkling and breaking therein. SOLUTION: In the production device 1 for an electronic circuit board, equipped with: a plurality of clampers 25 for sagging a continuous electronic circuit board 3 and c...
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| creator | KUSAKAI JIYUNICHI IWASAKI SHOJI HOSOYA KOJI SUKETA TSUTOMU |
| description | PROBLEM TO BE SOLVED: To carry an electronic circuit board without generating sagging, tightening, wrinkling and breaking therein. SOLUTION: In the production device 1 for an electronic circuit board, equipped with: a plurality of clampers 25 for sagging a continuous electronic circuit board 3 and clamping one side of the electronic circuit board 3; a driving apparatus 23 for moving the plurality of clampers 25 to a carrying direction; and a plating tank 7 for clamping the electronic circuit board 3 with the plurality of clampers 25, so as to be carried, and performing plating to the electronic circuit board 3, each clamper 25 is composed of: a clamp base part 29 moved by the driving device 23; and a clamp part 33 for clamping one side of the electronic circuit board 3, and provided at the lower part of the clamp base part 29 via a flexibility mechanism for imparting flexibility to the carrying direction and the vertical direction of the electronic circuit board 3. COPYRIGHT: (C)2007,JPO&INPIT |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2007211294A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2007211294A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2007211294A3</originalsourceid><addsrcrecordid>eNrjZHD0dQ3x8HdRcPMPUggI8ncJdfb0c1dw9XF1Dgny9_N0VnD2DHIO9QxRcPJ3DHJRcPRzUXBxDfN0dlUI8XANcgVq42FgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgYG5kaGhkaWJo7GRCkCABhQKyw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD FOR PRODUCING ELECTRONIC CIRCUIT BOARD AND DEVICE THEREFOR</title><source>esp@cenet</source><creator>KUSAKAI JIYUNICHI ; IWASAKI SHOJI ; HOSOYA KOJI ; SUKETA TSUTOMU</creator><creatorcontrib>KUSAKAI JIYUNICHI ; IWASAKI SHOJI ; HOSOYA KOJI ; SUKETA TSUTOMU</creatorcontrib><description>PROBLEM TO BE SOLVED: To carry an electronic circuit board without generating sagging, tightening, wrinkling and breaking therein. SOLUTION: In the production device 1 for an electronic circuit board, equipped with: a plurality of clampers 25 for sagging a continuous electronic circuit board 3 and clamping one side of the electronic circuit board 3; a driving apparatus 23 for moving the plurality of clampers 25 to a carrying direction; and a plating tank 7 for clamping the electronic circuit board 3 with the plurality of clampers 25, so as to be carried, and performing plating to the electronic circuit board 3, each clamper 25 is composed of: a clamp base part 29 moved by the driving device 23; and a clamp part 33 for clamping one side of the electronic circuit board 3, and provided at the lower part of the clamp base part 29 via a flexibility mechanism for imparting flexibility to the carrying direction and the vertical direction of the electronic circuit board 3. COPYRIGHT: (C)2007,JPO&INPIT</description><language>eng</language><subject>APPARATUS THEREFOR ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; PRINTED CIRCUITS ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><creationdate>2007</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20070823&DB=EPODOC&CC=JP&NR=2007211294A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20070823&DB=EPODOC&CC=JP&NR=2007211294A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KUSAKAI JIYUNICHI</creatorcontrib><creatorcontrib>IWASAKI SHOJI</creatorcontrib><creatorcontrib>HOSOYA KOJI</creatorcontrib><creatorcontrib>SUKETA TSUTOMU</creatorcontrib><title>METHOD FOR PRODUCING ELECTRONIC CIRCUIT BOARD AND DEVICE THEREFOR</title><description>PROBLEM TO BE SOLVED: To carry an electronic circuit board without generating sagging, tightening, wrinkling and breaking therein. SOLUTION: In the production device 1 for an electronic circuit board, equipped with: a plurality of clampers 25 for sagging a continuous electronic circuit board 3 and clamping one side of the electronic circuit board 3; a driving apparatus 23 for moving the plurality of clampers 25 to a carrying direction; and a plating tank 7 for clamping the electronic circuit board 3 with the plurality of clampers 25, so as to be carried, and performing plating to the electronic circuit board 3, each clamper 25 is composed of: a clamp base part 29 moved by the driving device 23; and a clamp part 33 for clamping one side of the electronic circuit board 3, and provided at the lower part of the clamp base part 29 via a flexibility mechanism for imparting flexibility to the carrying direction and the vertical direction of the electronic circuit board 3. COPYRIGHT: (C)2007,JPO&INPIT</description><subject>APPARATUS THEREFOR</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>PRINTED CIRCUITS</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2007</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHD0dQ3x8HdRcPMPUggI8ncJdfb0c1dw9XF1Dgny9_N0VnD2DHIO9QxRcPJ3DHJRcPRzUXBxDfN0dlUI8XANcgVq42FgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgYG5kaGhkaWJo7GRCkCABhQKyw</recordid><startdate>20070823</startdate><enddate>20070823</enddate><creator>KUSAKAI JIYUNICHI</creator><creator>IWASAKI SHOJI</creator><creator>HOSOYA KOJI</creator><creator>SUKETA TSUTOMU</creator><scope>EVB</scope></search><sort><creationdate>20070823</creationdate><title>METHOD FOR PRODUCING ELECTRONIC CIRCUIT BOARD AND DEVICE THEREFOR</title><author>KUSAKAI JIYUNICHI ; IWASAKI SHOJI ; HOSOYA KOJI ; SUKETA TSUTOMU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2007211294A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2007</creationdate><topic>APPARATUS THEREFOR</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>PRINTED CIRCUITS</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><toplevel>online_resources</toplevel><creatorcontrib>KUSAKAI JIYUNICHI</creatorcontrib><creatorcontrib>IWASAKI SHOJI</creatorcontrib><creatorcontrib>HOSOYA KOJI</creatorcontrib><creatorcontrib>SUKETA TSUTOMU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KUSAKAI JIYUNICHI</au><au>IWASAKI SHOJI</au><au>HOSOYA KOJI</au><au>SUKETA TSUTOMU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD FOR PRODUCING ELECTRONIC CIRCUIT BOARD AND DEVICE THEREFOR</title><date>2007-08-23</date><risdate>2007</risdate><abstract>PROBLEM TO BE SOLVED: To carry an electronic circuit board without generating sagging, tightening, wrinkling and breaking therein. SOLUTION: In the production device 1 for an electronic circuit board, equipped with: a plurality of clampers 25 for sagging a continuous electronic circuit board 3 and clamping one side of the electronic circuit board 3; a driving apparatus 23 for moving the plurality of clampers 25 to a carrying direction; and a plating tank 7 for clamping the electronic circuit board 3 with the plurality of clampers 25, so as to be carried, and performing plating to the electronic circuit board 3, each clamper 25 is composed of: a clamp base part 29 moved by the driving device 23; and a clamp part 33 for clamping one side of the electronic circuit board 3, and provided at the lower part of the clamp base part 29 via a flexibility mechanism for imparting flexibility to the carrying direction and the vertical direction of the electronic circuit board 3. COPYRIGHT: (C)2007,JPO&INPIT</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS |
| title | METHOD FOR PRODUCING ELECTRONIC CIRCUIT BOARD AND DEVICE THEREFOR |
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