SUBSTRATE FOR SEMICONDUCTOR DEVICE, AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a substrate for a semiconductor device for which problems of quality such as the decline of a bonding property due to dust sticking and sticking of chipping pieces and inter-layer short-circuits and inter-layer insulation decline due to metal burrs are dissolved, a base material composed of glass fibers and an epoxy resin is used and the loading density of a semiconductor element and electronic parts is high. SOLUTION: In the substrate 4 for the semiconductor device having a window open part 9 where window opening work is executed to the substrate in order to electrically connect the electrodes of the semiconductor element and the electronic parts and the electrode of the substrate with a wire, by atomizing or applying a resin on the substrate cross section part of the window open part, the substrate cross section part of the window open part is coated with the resin 24. COPYRIGHT: (C)2007,JPO&INPIT