ELECTROSTATIC CHUCK DEVICE

PROBLEM TO BE SOLVED: To provide an electrostatic chuck device where a temperature range when a temperature of a plate sample is controlled can be enlarged and secular fluctuation of a heat conduction characteristic can be reduced between the electrostatic chuck device and the plate sample. SOLUTION...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	NAKAGAWA YUSUKE, SASAKI YASUHARU, OKASHIRO TAKETOSHI, NAGAYAMA MASAYUKI, UEDA TAKEHIRO, KOSAKAI MAMORU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CONVERSION OR DISTRIBUTION OF ELECTRIC POWER DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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