ELECTROSTATIC CHUCK DEVICE

PROBLEM TO BE SOLVED: To provide an electrostatic chuck device where a temperature range when a temperature of a plate sample is controlled can be enlarged and secular fluctuation of a heat conduction characteristic can be reduced between the electrostatic chuck device and the plate sample. SOLUTION: In the electrostatic chuck device, an upper face 21a of a dielectric board 21 of a substrate which electrostatically attracts the plate sample W is set to be an electrostatic attraction face. A plurality of projections 31 are installed on the upper face 21a. One or more minute projections 32 are made in a top face 31a of a part of a plurality of the projections 31 or the whole projections 31. A region on which the plate sample W is placed and which is brought into contact with the plate sample W in the top face 32a of the minute projection 32 is set to be a placing face. A total area of the placing face in the electrostatic attraction face is se to be 0.01% to 2% of an area of the upper face 21a. COPYRIGHT: (C)2007,JPO&INPIT