METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To downsize a chipping size by suppressing a clogging of a blade during dicing a wafer. SOLUTION: A wafer 34 is cut with the use of a metal bond blade 31 including an abrasive coating having a grain size of not less than #3000 with its tip part V-shaped so that a V-shaped shoul...

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Bibliographische Detailangaben
1. Verfasser: IZUMI TADAO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Zusammenfassung:PROBLEM TO BE SOLVED: To downsize a chipping size by suppressing a clogging of a blade during dicing a wafer. SOLUTION: A wafer 34 is cut with the use of a metal bond blade 31 including an abrasive coating having a grain size of not less than #3000 with its tip part V-shaped so that a V-shaped shoulder part intrudes under from the surface of the wafer 34 (a depth Z2from the surface of a substrate). This machining can increase a cutting resistance to prevent the clogging of the blade. This can suppress the chipping size small in preventing the clogging of the blade. COPYRIGHT: (C)2007,JPO&INPIT