METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor package by which peeling on the interface between a first semiconductor chip and a die bonding agent can be suppressed. SOLUTION: A first silicon wafer substrate 1 wherein first semiconductor chips 2 are formed is adhered to...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ODA MASAKAZU, MATSUMOTO KEIJI, MATSUBARA YOJI, HORI KIYOTAKA, SASAKI NAOTO, TAKASU MICHIO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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