COMPONENT COMPRESSION-BONDING METHOD

COMPONENT COMPRESSION-BONDING METHOD

PROBLEM TO BE SOLVED: To provide a component compression-bonding method capable of preventing deterioration in yield of products by eliminating defective products by cleaning so that foreign substances on a stage surface may not be scattered. SOLUTION: A component compression-bonding apparatus mount...

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Hauptverfasser: TSUJI SHINJIRO, NARITA MASACHIKA, UENO TETSURO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator TSUJI SHINJIRO
NARITA MASACHIKA
UENO TETSURO
description PROBLEM TO BE SOLVED: To provide a component compression-bonding method capable of preventing deterioration in yield of products by eliminating defective products by cleaning so that foreign substances on a stage surface may not be scattered. SOLUTION: A component compression-bonding apparatus mounts an electronic component on a panel using a pressurizing device, in a state where the panel is placed on a stage surface 17 of a backup unit 6. Cleaning is executed so that the foreign substances on the stage surface 17 can be swept out in a side opposite to the side where the panel is placed, or to a side of carrying in or out the panel with respect to a support 6 by moving a cleaning section 21 provided inclined to the extending direction of the stage surface 17, thereby cleaning the stage surface 17. COPYRIGHT: (C)2007,JPO&INPIT
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title COMPONENT COMPRESSION-BONDING METHOD
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