TOUGH SHALLOW TRENCH SEPARATING STRUCTURE AND METHOD FOR FORMING SHALLOW TRENCH SEPARATING STRUCTURE

PROBLEM TO BE SOLVED: To provide a shallow trench separating structure that a dielectric material is located in voids of a material filled in the trench, and a method for forming its shallow trench separating structure concerning a semiconductor substrate. SOLUTION: In the method for forming the sha...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	RANBIA SING, NANDA ARUN K, ROSSI NACE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!