EQUIPMENT AND METHOD FOR SLURRY CLEANING ETCHING CHAMBER

PROBLEM TO BE SOLVED: To provide cleaning equipment and a method for removing debrisments effectively from a surface of semiconductor etching chamber. SOLUTION: The equipment has an atomization head 22 which includes an entrance port 4 of atomized flow object, an entrance port 6 of abrasive slurry,...

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Hauptverfasser: LAUBE DAVID P, DAVIS IAN MARTIN
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creator LAUBE DAVID P
DAVIS IAN MARTIN
description PROBLEM TO BE SOLVED: To provide cleaning equipment and a method for removing debrisments effectively from a surface of semiconductor etching chamber. SOLUTION: The equipment has an atomization head 22 which includes an entrance port 4 of atomized flow object, an entrance port 6 of abrasive slurry, and an exit port 8 of atomized abrasive slurry. However, in an aspect 200, an internal flow-passage includes a convergence-emission nozzles 24, 28 and a throat portion 26 profiled in more streamline. The throat portion 26 in this aspect includes an inlet hole or opening 16 for the abrasive slurry. The abrasive slurry is introduced in the throat portion 26 by a negative pressure generated by a flow of flowing fluid. The abrasive slurry can be pulled out from one or more abrasive slurry containers 20, and the head 22 can be equipped with one or more fluid connections to one or more flowing fluid supply sources 18. COPYRIGHT: (C)2007,JPO&INPIT
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title EQUIPMENT AND METHOD FOR SLURRY CLEANING ETCHING CHAMBER
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