EQUIPMENT AND METHOD FOR SLURRY CLEANING ETCHING CHAMBER
PROBLEM TO BE SOLVED: To provide cleaning equipment and a method for removing debrisments effectively from a surface of semiconductor etching chamber. SOLUTION: The equipment has an atomization head 22 which includes an entrance port 4 of atomized flow object, an entrance port 6 of abrasive slurry,...
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creator | LAUBE DAVID P DAVIS IAN MARTIN |
description | PROBLEM TO BE SOLVED: To provide cleaning equipment and a method for removing debrisments effectively from a surface of semiconductor etching chamber. SOLUTION: The equipment has an atomization head 22 which includes an entrance port 4 of atomized flow object, an entrance port 6 of abrasive slurry, and an exit port 8 of atomized abrasive slurry. However, in an aspect 200, an internal flow-passage includes a convergence-emission nozzles 24, 28 and a throat portion 26 profiled in more streamline. The throat portion 26 in this aspect includes an inlet hole or opening 16 for the abrasive slurry. The abrasive slurry is introduced in the throat portion 26 by a negative pressure generated by a flow of flowing fluid. The abrasive slurry can be pulled out from one or more abrasive slurry containers 20, and the head 22 can be equipped with one or more fluid connections to one or more flowing fluid supply sources 18. COPYRIGHT: (C)2007,JPO&INPIT |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2007173785A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2007173785A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2007173785A3</originalsourceid><addsrcrecordid>eNrjZLBwDQz1DPB19QtRcPRzUfB1DfHwd1Fw8w9SCPYJDQqKVHD2cXX08_RzV3ANcfYA0c4ejr5OrkE8DKxpiTnFqbxQmptByQ2kRDe1ID8-tbggMTk1L7Uk3ivAyMDA3NDc2NzC1NGYKEUAqy4o3A</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>EQUIPMENT AND METHOD FOR SLURRY CLEANING ETCHING CHAMBER</title><source>esp@cenet</source><creator>LAUBE DAVID P ; DAVIS IAN MARTIN</creator><creatorcontrib>LAUBE DAVID P ; DAVIS IAN MARTIN</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide cleaning equipment and a method for removing debrisments effectively from a surface of semiconductor etching chamber. SOLUTION: The equipment has an atomization head 22 which includes an entrance port 4 of atomized flow object, an entrance port 6 of abrasive slurry, and an exit port 8 of atomized abrasive slurry. However, in an aspect 200, an internal flow-passage includes a convergence-emission nozzles 24, 28 and a throat portion 26 profiled in more streamline. The throat portion 26 in this aspect includes an inlet hole or opening 16 for the abrasive slurry. The abrasive slurry is introduced in the throat portion 26 by a negative pressure generated by a flow of flowing fluid. The abrasive slurry can be pulled out from one or more abrasive slurry containers 20, and the head 22 can be equipped with one or more fluid connections to one or more flowing fluid supply sources 18. COPYRIGHT: (C)2007,JPO&INPIT</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2007</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20070705&DB=EPODOC&CC=JP&NR=2007173785A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20070705&DB=EPODOC&CC=JP&NR=2007173785A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LAUBE DAVID P</creatorcontrib><creatorcontrib>DAVIS IAN MARTIN</creatorcontrib><title>EQUIPMENT AND METHOD FOR SLURRY CLEANING ETCHING CHAMBER</title><description>PROBLEM TO BE SOLVED: To provide cleaning equipment and a method for removing debrisments effectively from a surface of semiconductor etching chamber. SOLUTION: The equipment has an atomization head 22 which includes an entrance port 4 of atomized flow object, an entrance port 6 of abrasive slurry, and an exit port 8 of atomized abrasive slurry. However, in an aspect 200, an internal flow-passage includes a convergence-emission nozzles 24, 28 and a throat portion 26 profiled in more streamline. The throat portion 26 in this aspect includes an inlet hole or opening 16 for the abrasive slurry. The abrasive slurry is introduced in the throat portion 26 by a negative pressure generated by a flow of flowing fluid. The abrasive slurry can be pulled out from one or more abrasive slurry containers 20, and the head 22 can be equipped with one or more fluid connections to one or more flowing fluid supply sources 18. COPYRIGHT: (C)2007,JPO&INPIT</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2007</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLBwDQz1DPB19QtRcPRzUfB1DfHwd1Fw8w9SCPYJDQqKVHD2cXX08_RzV3ANcfYA0c4ejr5OrkE8DKxpiTnFqbxQmptByQ2kRDe1ID8-tbggMTk1L7Uk3ivAyMDA3NDc2NzC1NGYKEUAqy4o3A</recordid><startdate>20070705</startdate><enddate>20070705</enddate><creator>LAUBE DAVID P</creator><creator>DAVIS IAN MARTIN</creator><scope>EVB</scope></search><sort><creationdate>20070705</creationdate><title>EQUIPMENT AND METHOD FOR SLURRY CLEANING ETCHING CHAMBER</title><author>LAUBE DAVID P ; DAVIS IAN MARTIN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2007173785A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2007</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>LAUBE DAVID P</creatorcontrib><creatorcontrib>DAVIS IAN MARTIN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LAUBE DAVID P</au><au>DAVIS IAN MARTIN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>EQUIPMENT AND METHOD FOR SLURRY CLEANING ETCHING CHAMBER</title><date>2007-07-05</date><risdate>2007</risdate><abstract>PROBLEM TO BE SOLVED: To provide cleaning equipment and a method for removing debrisments effectively from a surface of semiconductor etching chamber. SOLUTION: The equipment has an atomization head 22 which includes an entrance port 4 of atomized flow object, an entrance port 6 of abrasive slurry, and an exit port 8 of atomized abrasive slurry. However, in an aspect 200, an internal flow-passage includes a convergence-emission nozzles 24, 28 and a throat portion 26 profiled in more streamline. The throat portion 26 in this aspect includes an inlet hole or opening 16 for the abrasive slurry. The abrasive slurry is introduced in the throat portion 26 by a negative pressure generated by a flow of flowing fluid. The abrasive slurry can be pulled out from one or more abrasive slurry containers 20, and the head 22 can be equipped with one or more fluid connections to one or more flowing fluid supply sources 18. COPYRIGHT: (C)2007,JPO&INPIT</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | EQUIPMENT AND METHOD FOR SLURRY CLEANING ETCHING CHAMBER |
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