RELAY MEMBER TO BE ARRANGED ON SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

RELAY MEMBER TO BE ARRANGED ON SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor device provided with a relay member by enabling to arbitrarily set a bonding position or connection mode of bonding wires, and a method of manufacturing the semiconductor device which can inexpensively manufacture this semiconductor device. SOLUTION:...

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Hauptverfasser: NARISAWA YOSHIAKI, NISHIMURA TAKAO, KUMAGAI KINICHI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator NARISAWA YOSHIAKI
NISHIMURA TAKAO
KUMAGAI KINICHI
description PROBLEM TO BE SOLVED: To provide a semiconductor device provided with a relay member by enabling to arbitrarily set a bonding position or connection mode of bonding wires, and a method of manufacturing the semiconductor device which can inexpensively manufacture this semiconductor device. SOLUTION: The semiconductor device 10 is provided with a first semiconductor element 2 and a second semiconductor element 6, and a relay member 4 for relaying connection between the first semiconductor element 2 and the second semiconductor element 6, and connection between the second semiconductor element 6 or a wiring board 1 or a lead frame 22. The relay member 4 is arranged between the first and second semiconductor elements 2 and 6, the entire surface of a main surface of the relay member 4 is made of a conductor, and a bonding wire 7 connects the relay member 4 to the second semiconductor element 6, and connects the relay substrate 4 to the first semiconductor element 2 or the wiring board 1 or the lead frame 22. COPYRIGHT: (C)2007,JPO&INPIT
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title RELAY MEMBER TO BE ARRANGED ON SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
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