SILICONE RUBBER ADHESIVE COMPOSITION AND SEMICONDUCTOR DEVICE USING THE SAME
PROBLEM TO BE SOLVED: To provide a silicone rubber adhesive composition, wherein wire-bondability after jointing a semiconductor pellet to a member for mounting a semiconductor pellet is not deteriorated, and to provide a semiconductor device using the same. SOLUTION: The silicone rubber adhesive co...
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| creator | HIRAI NOBUO |
| description | PROBLEM TO BE SOLVED: To provide a silicone rubber adhesive composition, wherein wire-bondability after jointing a semiconductor pellet to a member for mounting a semiconductor pellet is not deteriorated, and to provide a semiconductor device using the same. SOLUTION: The silicone rubber adhesive composition comprises (A) a polyorgano siloxane containing 2 or more alkenyl groups bound to two or more silicone atoms in a molecule, the content of the alkenyl group being 30-600 mmol/100 g, (B) a polyorgano hydrogen siloxane containing 3 or more SiH groups per molecule, (C) a platinum type catalyst and (D) an adhesive agent, the cured product of the composition having a complex modulus of 0.9 MPa or more at 23°C and 10 Hz shearing frequency and die-shear hardness of 0.05 MPa or more. The semiconductor device comprises a semiconductor pellet and a member for mounting a semiconductor pellet, which are jointed by a cured product of the above silicone rubber adhesive agent. COPYRIGHT: (C)2007,JPO&INPIT |
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SOLUTION: The silicone rubber adhesive composition comprises (A) a polyorgano siloxane containing 2 or more alkenyl groups bound to two or more silicone atoms in a molecule, the content of the alkenyl group being 30-600 mmol/100 g, (B) a polyorgano hydrogen siloxane containing 3 or more SiH groups per molecule, (C) a platinum type catalyst and (D) an adhesive agent, the cured product of the composition having a complex modulus of 0.9 MPa or more at 23°C and 10 Hz shearing frequency and die-shear hardness of 0.05 MPa or more. The semiconductor device comprises a semiconductor pellet and a member for mounting a semiconductor pellet, which are jointed by a cured product of the above silicone rubber adhesive agent. 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SOLUTION: The silicone rubber adhesive composition comprises (A) a polyorgano siloxane containing 2 or more alkenyl groups bound to two or more silicone atoms in a molecule, the content of the alkenyl group being 30-600 mmol/100 g, (B) a polyorgano hydrogen siloxane containing 3 or more SiH groups per molecule, (C) a platinum type catalyst and (D) an adhesive agent, the cured product of the composition having a complex modulus of 0.9 MPa or more at 23°C and 10 Hz shearing frequency and die-shear hardness of 0.05 MPa or more. The semiconductor device comprises a semiconductor pellet and a member for mounting a semiconductor pellet, which are jointed by a cured product of the above silicone rubber adhesive agent. COPYRIGHT: (C)2007,JPO&INPIT</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>DYES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2007</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyr0KwjAQAOAsDqK-w-EuxD-kY5qc5qRJSi7pWorESbRQ3x8RfACnb_nmomFqSAePEHNdYwRlLDJ1CDq4NjAlCh6UN8DovtFknUIEgx1phMzkL5AsAiuHSzG7D4-prH4uxPqMSdtNGV99mcbhVp7l3V_bnZSn7fEgq0rt_0ofH-IudQ</recordid><startdate>20070621</startdate><enddate>20070621</enddate><creator>HIRAI NOBUO</creator><scope>EVB</scope></search><sort><creationdate>20070621</creationdate><title>SILICONE RUBBER ADHESIVE COMPOSITION AND SEMICONDUCTOR DEVICE USING THE SAME</title><author>HIRAI NOBUO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2007154099A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2007</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>DYES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>HIRAI NOBUO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HIRAI NOBUO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SILICONE RUBBER ADHESIVE COMPOSITION AND SEMICONDUCTOR DEVICE USING THE SAME</title><date>2007-06-21</date><risdate>2007</risdate><abstract>PROBLEM TO BE SOLVED: To provide a silicone rubber adhesive composition, wherein wire-bondability after jointing a semiconductor pellet to a member for mounting a semiconductor pellet is not deteriorated, and to provide a semiconductor device using the same. 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| language | eng |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES |
| title | SILICONE RUBBER ADHESIVE COMPOSITION AND SEMICONDUCTOR DEVICE USING THE SAME |
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