MULTI-CHIP MODULE

MULTI-CHIP MODULE

PROBLEM TO BE SOLVED: To provide a multi-chip module for realizing high function or high performance. SOLUTION: The multi-chip module comprises a first semiconductor chip on which a digital signal processing circuit is mounted; a second semiconductor chip constituting a dynamic random access memory;...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: HIRANUMA KAZUHIKO, KURODA HIROSHI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a multi-chip module for realizing high function or high performance. SOLUTION: The multi-chip module comprises a first semiconductor chip on which a digital signal processing circuit is mounted; a second semiconductor chip constituting a dynamic random access memory; a third semiconductor chip constituting a nonvolatile memory; and a mounting substrate, all assembled into a stacked structure. The first semiconductor chip is disposed on the uppermost layer mediating a spacer provided on the side of a rear surface thereof. The second semiconductor chip is disposed on the mounting substrate. COPYRIGHT: (C)2007,JPO&INPIT