SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SAME

SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SAME

PROBLEM TO BE SOLVED: To provide a semiconductor device formed in such a way that a micro-device including a functional element having a vibrator or a movable portion is hermetically sealed and incorporated on a functional surface such as an MEMS, SAW element or an F-BAR, eliminating the necessity o...

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1. Verfasser: OYA YOICHI
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
BASIC ELECTRONIC CIRCUITRY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
RESONATORS
SEMICONDUCTOR DEVICES
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creator OYA YOICHI
description PROBLEM TO BE SOLVED: To provide a semiconductor device formed in such a way that a micro-device including a functional element having a vibrator or a movable portion is hermetically sealed and incorporated on a functional surface such as an MEMS, SAW element or an F-BAR, eliminating the necessity of a hollow substrate for configuring a hollow portion and capable of being miniaturized or thinned, and to provide a method of manufacturing the same. SOLUTION: The semiconductor device has a configuration in which an electrode 11 is formed on a substrate 10, the micro-device 14 including the functional element having the movable portion or the vibrator formed on the functional surface 14s and the bump 15 formed on the functional surface 14s is mounted so that the bump 15 may be connected to the electrode 11 and the functional surface 14s may not contact the substrate 10, and a resin layer 18 containing a liquid crystal polymer is formed so as to cover a surface other than the functional surface 14s of the micro-device 14 and to configure the hollow portion C by sealing the functional surface 14s. COPYRIGHT: (C)2007,JPO&INPIT
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SOLUTION: The semiconductor device has a configuration in which an electrode 11 is formed on a substrate 10, the micro-device 14 including the functional element having the movable portion or the vibrator formed on the functional surface 14s and the bump 15 formed on the functional surface 14s is mounted so that the bump 15 may be connected to the electrode 11 and the functional surface 14s may not contact the substrate 10, and a resin layer 18 containing a liquid crystal polymer is formed so as to cover a surface other than the functional surface 14s of the micro-device 14 and to configure the hollow portion C by sealing the functional surface 14s. 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subjects BASIC ELECTRIC ELEMENTS
BASIC ELECTRONIC CIRCUITRY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
RESONATORS
SEMICONDUCTOR DEVICES
title SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SAME
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