SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SAME

PROBLEM TO BE SOLVED: To provide a semiconductor device having a solder bump capable of suppressing cracks due to thermal stress etc. by improving strength, and to provide a method of manufacturing the same. SOLUTION: On a semiconductor substrate having an electronic circuit formed thereon, a base l...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	OYA YOICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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