RESIN SEALING MOLDING APPARATUS FOR ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide a resin sealing molding apparatus for an electronic component which can minimize the occurrence of the flow of a resin material in a cavity space part when the resin material used during resin sealing molding is supplied into a mold (cavity space part). SOLUTION: In...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NAKAMURA MAMORU, HANAZAKI MASANORI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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