GALVANIZING TREATMENT METHOD
PROBLEM TO BE SOLVED: To provide a galvanizing treatment method capable of obtaining a plating film having characteristics equal to those of the conventional one using a plating liquid in which the concentration of each additive is low. SOLUTION: A work is dipped into a plating liquid comprising: zi...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | HOTTA HIROMITSU INAGUMA YASUJI MIYAKE TAKESHI |
| description | PROBLEM TO BE SOLVED: To provide a galvanizing treatment method capable of obtaining a plating film having characteristics equal to those of the conventional one using a plating liquid in which the concentration of each additive is low. SOLUTION: A work is dipped into a plating liquid comprising: zinc chloride in 40 to 90 g/L, potassium chloride in 180 to 240 g/L, boric acid in 20 to 40 g/L, polyethylene glycol with a molecular weight of 6,000 to 20,000 in 2 to 5 g/L; and potassium benzoate in 2 to 5 g/L, and is subjected to pulse electrolysis, so as to be plated. The plating liquid may comprise: polyethylene glycol with a molecular weight of 6,000 to 20,000 in 0.5 to 5 g/L; and benzaldehyde in 0.5 to 2.0 g/L as well. The pulse electrolysis is performed preferably under the conditions satisfying an on time of 0.3 to 1.0 ms, a duty ratio of 5 to 20%, and an average current density of 2 to 5 A/dm2. COPYRIGHT: (C)2007,JPO&INPIT |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2007100197A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2007100197A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2007100197A3</originalsourceid><addsrcrecordid>eNrjZJBxd_QJc_TzjPL0c1cICXJ1DPF19QtR8HUN8fB34WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgYG5oYGBoaW5o7GRCkCAMKAIVw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>GALVANIZING TREATMENT METHOD</title><source>esp@cenet</source><creator>HOTTA HIROMITSU ; INAGUMA YASUJI ; MIYAKE TAKESHI</creator><creatorcontrib>HOTTA HIROMITSU ; INAGUMA YASUJI ; MIYAKE TAKESHI</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a galvanizing treatment method capable of obtaining a plating film having characteristics equal to those of the conventional one using a plating liquid in which the concentration of each additive is low. SOLUTION: A work is dipped into a plating liquid comprising: zinc chloride in 40 to 90 g/L, potassium chloride in 180 to 240 g/L, boric acid in 20 to 40 g/L, polyethylene glycol with a molecular weight of 6,000 to 20,000 in 2 to 5 g/L; and potassium benzoate in 2 to 5 g/L, and is subjected to pulse electrolysis, so as to be plated. The plating liquid may comprise: polyethylene glycol with a molecular weight of 6,000 to 20,000 in 0.5 to 5 g/L; and benzaldehyde in 0.5 to 2.0 g/L as well. The pulse electrolysis is performed preferably under the conditions satisfying an on time of 0.3 to 1.0 ms, a duty ratio of 5 to 20%, and an average current density of 2 to 5 A/dm2. COPYRIGHT: (C)2007,JPO&INPIT</description><language>eng</language><subject>APPARATUS THEREFOR ; CHEMISTRY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; METALLURGY ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><creationdate>2007</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20070419&DB=EPODOC&CC=JP&NR=2007100197A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20070419&DB=EPODOC&CC=JP&NR=2007100197A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HOTTA HIROMITSU</creatorcontrib><creatorcontrib>INAGUMA YASUJI</creatorcontrib><creatorcontrib>MIYAKE TAKESHI</creatorcontrib><title>GALVANIZING TREATMENT METHOD</title><description>PROBLEM TO BE SOLVED: To provide a galvanizing treatment method capable of obtaining a plating film having characteristics equal to those of the conventional one using a plating liquid in which the concentration of each additive is low. SOLUTION: A work is dipped into a plating liquid comprising: zinc chloride in 40 to 90 g/L, potassium chloride in 180 to 240 g/L, boric acid in 20 to 40 g/L, polyethylene glycol with a molecular weight of 6,000 to 20,000 in 2 to 5 g/L; and potassium benzoate in 2 to 5 g/L, and is subjected to pulse electrolysis, so as to be plated. The plating liquid may comprise: polyethylene glycol with a molecular weight of 6,000 to 20,000 in 0.5 to 5 g/L; and benzaldehyde in 0.5 to 2.0 g/L as well. The pulse electrolysis is performed preferably under the conditions satisfying an on time of 0.3 to 1.0 ms, a duty ratio of 5 to 20%, and an average current density of 2 to 5 A/dm2. COPYRIGHT: (C)2007,JPO&INPIT</description><subject>APPARATUS THEREFOR</subject><subject>CHEMISTRY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>METALLURGY</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2007</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJBxd_QJc_TzjPL0c1cICXJ1DPF19QtR8HUN8fB34WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgYG5oYGBoaW5o7GRCkCAMKAIVw</recordid><startdate>20070419</startdate><enddate>20070419</enddate><creator>HOTTA HIROMITSU</creator><creator>INAGUMA YASUJI</creator><creator>MIYAKE TAKESHI</creator><scope>EVB</scope></search><sort><creationdate>20070419</creationdate><title>GALVANIZING TREATMENT METHOD</title><author>HOTTA HIROMITSU ; INAGUMA YASUJI ; MIYAKE TAKESHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2007100197A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2007</creationdate><topic>APPARATUS THEREFOR</topic><topic>CHEMISTRY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>METALLURGY</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><toplevel>online_resources</toplevel><creatorcontrib>HOTTA HIROMITSU</creatorcontrib><creatorcontrib>INAGUMA YASUJI</creatorcontrib><creatorcontrib>MIYAKE TAKESHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HOTTA HIROMITSU</au><au>INAGUMA YASUJI</au><au>MIYAKE TAKESHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>GALVANIZING TREATMENT METHOD</title><date>2007-04-19</date><risdate>2007</risdate><abstract>PROBLEM TO BE SOLVED: To provide a galvanizing treatment method capable of obtaining a plating film having characteristics equal to those of the conventional one using a plating liquid in which the concentration of each additive is low. SOLUTION: A work is dipped into a plating liquid comprising: zinc chloride in 40 to 90 g/L, potassium chloride in 180 to 240 g/L, boric acid in 20 to 40 g/L, polyethylene glycol with a molecular weight of 6,000 to 20,000 in 2 to 5 g/L; and potassium benzoate in 2 to 5 g/L, and is subjected to pulse electrolysis, so as to be plated. The plating liquid may comprise: polyethylene glycol with a molecular weight of 6,000 to 20,000 in 0.5 to 5 g/L; and benzaldehyde in 0.5 to 2.0 g/L as well. The pulse electrolysis is performed preferably under the conditions satisfying an on time of 0.3 to 1.0 ms, a duty ratio of 5 to 20%, and an average current density of 2 to 5 A/dm2. COPYRIGHT: (C)2007,JPO&INPIT</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_JP2007100197A |
| source | esp@cenet |
| subjects | APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS |
| title | GALVANIZING TREATMENT METHOD |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-03T06%3A59%3A05IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=HOTTA%20HIROMITSU&rft.date=2007-04-19&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2007100197A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |