HOT-MELT COMPOSITION

PROBLEM TO BE SOLVED: To provide a hot-melt composition useful as an adhesive, a sealant, etc., which ensures adhesion to a difficult-to-bond polyolefin material and shows good application and discharging properties, heat resistance, heat aging resistance, etc., at a temperature around 200°C or lowe...

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Bibliographische Detailangaben
Hauptverfasser:	NAKAMURA TOMOYA, IWATSUKA YUJI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a hot-melt composition useful as an adhesive, a sealant, etc., which ensures adhesion to a difficult-to-bond polyolefin material and shows good application and discharging properties, heat resistance, heat aging resistance, etc., at a temperature around 200°C or lower. SOLUTION: The hot-melt composition contains at least a styrene block copolymer, a polyphenylene ether resin or a modified polyphenylene ether resin having a heat deflection temperature or a glass transition temperature of 120°C or higher, an amorphous polyolefin, a tackifier and an age resister and has melt viscosity at 200°C of 30 Pa s or smaller. COPYRIGHT: (C)2007,JPO&INPIT