METHOD OF FORMING SELF-ALIGNED CONTACT PAD USING CHEMICAL MECHANICAL POLISHING PROCESS

PROBLEM TO BE SOLVED: To provide a method of forming a self-aligned contact pad using a Chemical Mechanical Polishing process. SOLUTION: The method includes steps of: forming stacks of a conductive line and an insulating capping layer, spacers, and insulating layers configured to expose the top of t...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HONG CHANGKI, IN FUGEN, BOKU SHUNSO, KIM HO-YOUNG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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