JOINING HEAD AND JOINING APPARATUS OF ELECTRONIC COMPONENT

JOINING HEAD AND JOINING APPARATUS OF ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide a joining head of electronic components which efficiently transmits the vibration of a vibration amplifier to a crimp with a simple configuration, even if the crimp is attached to or detached from the vibration amplifier. SOLUTION: The joining head 5 of electronic co...

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Hauptverfasser: YAMAGISHI AKITAKA, NEHASHI TORU, HERAI MASAYASU, MATSUNO MASAHISA
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator YAMAGISHI AKITAKA
NEHASHI TORU
HERAI MASAYASU
MATSUNO MASAHISA
description PROBLEM TO BE SOLVED: To provide a joining head of electronic components which efficiently transmits the vibration of a vibration amplifier to a crimp with a simple configuration, even if the crimp is attached to or detached from the vibration amplifier. SOLUTION: The joining head 5 of electronic components for joining a substrate to electronic components 4 comprises: a vibration generator 30; a vibration amplifier 31 for amplifying vibration generated from the vibration generator 30; and a crimp 32 for crimping the electronic components 4 to the substrate while giving vibration amplified by the vibration amplifier 31 to the electronic components 4. A washer 34 that is formed by a metal member having lower hardness than that of the crimp 32 and is interposed between the crimp 32 and the vibration amplifier 31 is deformed, when connecting an external thread 32b and an internal thread 31d for detachably connecting the crimp 32 to the vibration amplifier 32 and adheres to the crimp 31 and the vibration amplifier 31. COPYRIGHT: (C)2007,JPO&INPIT
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title JOINING HEAD AND JOINING APPARATUS OF ELECTRONIC COMPONENT
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