POLISHING METHOD OF SEMICONDUCTOR WAFER
PROBLEM TO BE SOLVED: To provide a polishing method of a semiconductor wafer which polishes the semiconductor wafer appropriately. SOLUTION: In a slurry adjustment process in a slurry adjustment 150, a secondary polishing slurry adjustment liquid is supplied to a secondary polishing section 132. The...
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| creator | WAKABAYASHI HIROZO KOSASA KAZUAKI YAMADA GENJI TOMITA YASUHIRO |
| description | PROBLEM TO BE SOLVED: To provide a polishing method of a semiconductor wafer which polishes the semiconductor wafer appropriately. SOLUTION: In a slurry adjustment process in a slurry adjustment 150, a secondary polishing slurry adjustment liquid is supplied to a secondary polishing section 132. The secondary polishing slurry adjustment liquid is adjusted so that an Si/O composition ratio becomes 50 wt.% to 60 wt.%/40 wt.% to 50 wt.%, modulus of elasticity becomes 1.4×1010Pa or higher, and the number of dry silica whose grain diameter is 1 μm or larger becomes 3,000/ml or smaller. In a secondary polishing process at the secondary polishing section 132, the secondary polishing slurry adjustment liquid supplied from the slurry adjustment 150 is utilized to perform the secondary polishing of a semiconductor wafer W. COPYRIGHT: (C)2007,JPO&INPIT |
| format | Patent |
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| subjects | ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DRESSING OR CONDITIONING OF ABRADING SURFACES DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PERFORMING OPERATIONS POLISHES POLISHING SEMICONDUCTOR DEVICES TRANSPORTING |
| title | POLISHING METHOD OF SEMICONDUCTOR WAFER |
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