EXPOSURE METHOD AND EQUIPMENT, AND METHOD FOR MANUFACTURING DEVICE

PROBLEM TO BE SOLVED: To provide an exposure technology capable of forming a fine pattern on the level of the wavelength of illumination light or less inexpensively. SOLUTION: An interference pattern is formed by irradiating two transparent plates P1 and P2, each having a grating formed thereon, wit...

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Bibliographische Detailangaben
1. Verfasser:	UMAGOME NOBUTAKA
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an exposure technology capable of forming a fine pattern on the level of the wavelength of illumination light or less inexpensively. SOLUTION: An interference pattern is formed by irradiating two transparent plates P1 and P2, each having a grating formed thereon, with illumination light and a wafer W is exposed by that interference pattern. Holders 36A and 36B are supported movably in a plane parallel with the surface of the wafer W and in the direction perpendicular to that surface, the transparent plate P1 is suction held through air pads 100A and 100B secured to the bottom face of the upper holder 36A, and the transparent plate P2 is suction held through air pads 102A and 102B secured to the bottom face of the lower holder 37A. COPYRIGHT: (C)2007,JPO&INPIT