METHOD OF DETECTING DISCONNECTION OF WIRE SAW, METHOD OF INSPECTION QUALITY, AND METHOD OF MANUFACTURING CUT PRODUCT
PROBLEM TO BE SOLVED: To provide a resin bond wire saw to be used in slicing a silicon wafer, which is electrically conductive by itself, and has a high retention force of abrasive grains and excellent sharpness. SOLUTION: One end of a metal coated abrasive grain is brought into contact with a metal...
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| creator | OGAWA HIDEKI YAMANAKA MASAAKI URAKAWA NOBUO HARA AKIO |
| description | PROBLEM TO BE SOLVED: To provide a resin bond wire saw to be used in slicing a silicon wafer, which is electrically conductive by itself, and has a high retention force of abrasive grains and excellent sharpness. SOLUTION: One end of a metal coated abrasive grain is brought into contact with a metallic core wire 1 and part of it is exposed from a bonded surface, thereby providing electric conductivity to the core wire from the external surface of the wire saw so as to detect disconnection during processing. In addition, bonding strength with a resin 3 serving as a bond is improved through the use of the metal coated abrasive grain 2, and further increased by plating the core wire 1 with copper or copper alloy, to thereby prevent the abrasive grain from missing or the bond from peeling. Two conductive rolls are used to inspect the disconnection of the wire saw. COPYRIGHT: (C)2007,JPO&INPIT |
| format | Patent |
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SOLUTION: One end of a metal coated abrasive grain is brought into contact with a metallic core wire 1 and part of it is exposed from a bonded surface, thereby providing electric conductivity to the core wire from the external surface of the wire saw so as to detect disconnection during processing. In addition, bonding strength with a resin 3 serving as a bond is improved through the use of the metal coated abrasive grain 2, and further increased by plating the core wire 1 with copper or copper alloy, to thereby prevent the abrasive grain from missing or the bond from peeling. Two conductive rolls are used to inspect the disconnection of the wire saw. 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| subjects | BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING |
| title | METHOD OF DETECTING DISCONNECTION OF WIRE SAW, METHOD OF INSPECTION QUALITY, AND METHOD OF MANUFACTURING CUT PRODUCT |
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