COMPOSITE IC CARD AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a manufacturing method capable of manufacturing a composite IC card for which the peel strength of an IC module is high while securing connection with an antenna coil in a card base body by turning the shape of a stress mitigation groove formed in an IC card mounting recessed part of the composite IC card to a specified shape, and the composite IC card by the manufacturing method. SOLUTION: On the composite IC card, the IC module for both contact and non-contact types is mounted. For the IC module mounting recessed part 20 cut in an IC card base body in order to mount the composite IC module, the stress mitigation groove 18 for mitigating bending stress added to the card base body is cut only at a part excluding an edge side along the outer circumferential area of the surface of a first recessed part 21 in the recessed part, which is the edge side close to recessed holes 15 and 16 for antenna coil connection at two parts. The stress mitigation groove 18 is in the width of 0.3 mm to 1.2 mm and can be cut in such a depth that it does not reach the antenna coil. COPYRIGHT: (C)2007,JPO&INPIT