MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND A MANUFACTURING EQUIPMENT

PROBLEM TO BE SOLVED: To make it possible to secure sufficiently the reliability of connection by flip chip mounting, and also to avoid causing complication of manufacturing equipment composition etc. in the semiconductor device of flip chip mounting. SOLUTION: The manufacturing method of a semicond...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	AOYANAGI TETSUTOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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