MICRO DEVICE AND PACKAGING METHOD THEREOF
PROBLEM TO BE SOLVED: To provide a packaging method of a micro device with which a size of a substrate and that of a cap in the micro device having a function element having a vibrator or a movable part in a function face is made different, and which can easily be packaged, and to provide the micro...
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| creator | OYA YOICHI |
| description | PROBLEM TO BE SOLVED: To provide a packaging method of a micro device with which a size of a substrate and that of a cap in the micro device having a function element having a vibrator or a movable part in a function face is made different, and which can easily be packaged, and to provide the micro device which is packaged by the packaging method. SOLUTION: A device wafer 10w is formed where a plurality of device substrates having function elements where the movable parts or the vibrators are formed on the function faces are integrated. A cap wafer 12w where a plurality of caps constituting a cavity are integrated is diced into halves so that they divide respective cap regions so as to form grooves 12h. The device wafer and the cap wafer are bonded by a bonding layer so that the cavities C are constituted of the function face and surfaces of the cap wafer and the bonding layer 13. The cap wafer is divided into the caps 12 at a position of half dicing, and the device wafer is divided into the respective device substrates 10. COPYRIGHT: (C)2007,JPO&INPIT |
| format | Patent |
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SOLUTION: A device wafer 10w is formed where a plurality of device substrates having function elements where the movable parts or the vibrators are formed on the function faces are integrated. A cap wafer 12w where a plurality of caps constituting a cavity are integrated is diced into halves so that they divide respective cap regions so as to form grooves 12h. The device wafer and the cap wafer are bonded by a bonding layer so that the cavities C are constituted of the function face and surfaces of the cap wafer and the bonding layer 13. The cap wafer is divided into the caps 12 at a position of half dicing, and the device wafer is divided into the respective device substrates 10. 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SOLUTION: A device wafer 10w is formed where a plurality of device substrates having function elements where the movable parts or the vibrators are formed on the function faces are integrated. A cap wafer 12w where a plurality of caps constituting a cavity are integrated is diced into halves so that they divide respective cap regions so as to form grooves 12h. The device wafer and the cap wafer are bonded by a bonding layer so that the cavities C are constituted of the function face and surfaces of the cap wafer and the bonding layer 13. The cap wafer is divided into the caps 12 at a position of half dicing, and the device wafer is divided into the respective device substrates 10. 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SOLUTION: A device wafer 10w is formed where a plurality of device substrates having function elements where the movable parts or the vibrators are formed on the function faces are integrated. A cap wafer 12w where a plurality of caps constituting a cavity are integrated is diced into halves so that they divide respective cap regions so as to form grooves 12h. The device wafer and the cap wafer are bonded by a bonding layer so that the cavities C are constituted of the function face and surfaces of the cap wafer and the bonding layer 13. The cap wafer is divided into the caps 12 at a position of half dicing, and the device wafer is divided into the respective device substrates 10. COPYRIGHT: (C)2007,JPO&INPIT</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS BASIC ELECTRONIC CIRCUITRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS RESONATORS SEMICONDUCTOR DEVICES |
| title | MICRO DEVICE AND PACKAGING METHOD THEREOF |
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