MANUFACTURING METHOD OF ANISOTROPIC CONDUCTIVE FILM
PROBLEM TO BE SOLVED: To provide a manufacturing method of an anisotropic conductive film, which is provided with a process for easily and selectively filling hole parts of a porous film with conductive material. SOLUTION: The manufacturing method is provided with processes of: forming the porous fi...
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| creator | SATO HIDEYUKI BESSHO HISAMI SATO AKIO |
| description | PROBLEM TO BE SOLVED: To provide a manufacturing method of an anisotropic conductive film, which is provided with a process for easily and selectively filling hole parts of a porous film with conductive material. SOLUTION: The manufacturing method is provided with processes of: forming the porous film which has a plurality of hole parts in a film thickness direction and consists of high polymer; filling the hole parts of the porous film with conductive material; and covering bonding layers on both faces of the porous film. In filling of conductive material, the porous film is fixed onto a first substrate and a second substrate is arranged by leaving a prescribed distance with the porous film. Distributed solution obtained by distributing conductive material in solvent is introduced to a clearance between the porous film and the second substrate. At least one substrate is moved to a film face direction while magnetic force is added to conductive material in a direction where adsorption force of conductive material to a film surface is negated. COPYRIGHT: (C)2007,JPO&INPIT |
| format | Patent |
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SOLUTION: The manufacturing method is provided with processes of: forming the porous film which has a plurality of hole parts in a film thickness direction and consists of high polymer; filling the hole parts of the porous film with conductive material; and covering bonding layers on both faces of the porous film. In filling of conductive material, the porous film is fixed onto a first substrate and a second substrate is arranged by leaving a prescribed distance with the porous film. Distributed solution obtained by distributing conductive material in solvent is introduced to a clearance between the porous film and the second substrate. At least one substrate is moved to a film face direction while magnetic force is added to conductive material in a direction where adsorption force of conductive material to a film surface is negated. 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| subjects | BASIC ELECTRIC ELEMENTS CABLES CONDUCTORS CURRENT COLLECTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM LINE CONNECTORS PERFORMING OPERATIONS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SEMICONDUCTOR DEVICES TRANSPORTING |
| title | MANUFACTURING METHOD OF ANISOTROPIC CONDUCTIVE FILM |
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