IMAGE PICKUP DEVICE FOR DIE BONDER

PROBLEM TO BE SOLVED: To attain highly precise two-dimensional and three-dimensional image recognition by a stereo vision by a plurality of cameras in a die bonder. SOLUTION: A shift-lens optical system is configured by vertically arranging a plurality of cameras 3 and 4 on the substrate for allocat...

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Hauptverfasser:	KOTO ATSUSHI, YAMAMOTO TAKAKO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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creator	KOTO ATSUSHI YAMAMOTO TAKAKO
description	PROBLEM TO BE SOLVED: To attain highly precise two-dimensional and three-dimensional image recognition by a stereo vision by a plurality of cameras in a die bonder. SOLUTION: A shift-lens optical system is configured by vertically arranging a plurality of cameras 3 and 4 on the substrate for allocating chips 1 in parallel at the upper part of the conveyance path of a carrier 2 such as a frame or tape so that their optical axes can be made vertical to the conveyance path. The image pickup regions of those cameras 3 and 4 are overlapped on the conveyance path, and the image of the bonding region of the carrier 2 moving to the overlapped image pickup region is recognized by stereo vision. COPYRIGHT: (C)2007,JPO&INPIT
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subjects	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
title	IMAGE PICKUP DEVICE FOR DIE BONDER
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