PATTERNED WALL PANEL AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To reduce weight, and to improve heat insulating performance, by reducing the more processes such as lamination and hardening than a conventional patterned wall material. SOLUTION: This patterned wall panel has respective layers of a transparent or opaque surface resin layer 11...

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Bibliographische Detailangaben
Hauptverfasser:	TAOKA HIDEMI, HAMANO TAKAKO, HONDA NORIO
Format:	Patent
Sprache:	eng
Schlagworte:	BUILDING FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS FIXED CONSTRUCTIONS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCESIN A PLASTIC STATE TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To reduce weight, and to improve heat insulating performance, by reducing the more processes such as lamination and hardening than a conventional patterned wall material. SOLUTION: This patterned wall panel has respective layers of a transparent or opaque surface resin layer 11 for revealing a pattern, a pattern layer 12, and a thermosetting resin foaming mold 13 in order from the surface side. Heat conductivity of the thermosetting resin foaming mold is set to 0.1 to 0.3 W/mK, and the specific gravity is set to 0.5 to 1.5. COPYRIGHT: (C)2007,JPO&INPIT