SYSTEM AND METHOD FOR REDUCING SIMULTANEOUS SWITCHING NOISE IN INTEGRATED CIRCUIT
PROBLEM TO BE SOLVED: To reduce a switching noise in an integrated circuit without reducing the effectiveness of a heat sink/spreader used along with the integrated circuit. SOLUTION: A device comprises an integrated circuit 510 and one or more decoupling capacitors 540 externally connected to the i...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | HOSOMI HIDEKAZU PAUL HARVEY |
| description | PROBLEM TO BE SOLVED: To reduce a switching noise in an integrated circuit without reducing the effectiveness of a heat sink/spreader used along with the integrated circuit. SOLUTION: A device comprises an integrated circuit 510 and one or more decoupling capacitors 540 externally connected to the integrated circuit 510. The decoupling capacitor 540 is arranged in one or more hot spots 520 and 521 in the integrated circuit 510 so as to have a higher concentration. COPYRIGHT: (C)2007,JPO&INPIT |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2006295193A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2006295193A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2006295193A3</originalsourceid><addsrcrecordid>eNrjZAgMjgwOcfVVcPRzUfB1DfHwd1Fw8w9SCHJ1CXX29HNXCPb0DfUJcfRz9Q8NVggO9wxx9gAJ-_l7BrsqePoBUYire5BjiKuLgrNnkHOoZwgPA2taYk5xKi-U5mZQcnMFatNNLciPTy0uSExOzUstifcKMDIwMDOyNDW0NHY0JkoRACGFMA8</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SYSTEM AND METHOD FOR REDUCING SIMULTANEOUS SWITCHING NOISE IN INTEGRATED CIRCUIT</title><source>esp@cenet</source><creator>HOSOMI HIDEKAZU ; PAUL HARVEY</creator><creatorcontrib>HOSOMI HIDEKAZU ; PAUL HARVEY</creatorcontrib><description>PROBLEM TO BE SOLVED: To reduce a switching noise in an integrated circuit without reducing the effectiveness of a heat sink/spreader used along with the integrated circuit. SOLUTION: A device comprises an integrated circuit 510 and one or more decoupling capacitors 540 externally connected to the integrated circuit 510. The decoupling capacitor 540 is arranged in one or more hot spots 520 and 521 in the integrated circuit 510 so as to have a higher concentration. COPYRIGHT: (C)2007,JPO&INPIT</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2006</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20061026&DB=EPODOC&CC=JP&NR=2006295193A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20061026&DB=EPODOC&CC=JP&NR=2006295193A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HOSOMI HIDEKAZU</creatorcontrib><creatorcontrib>PAUL HARVEY</creatorcontrib><title>SYSTEM AND METHOD FOR REDUCING SIMULTANEOUS SWITCHING NOISE IN INTEGRATED CIRCUIT</title><description>PROBLEM TO BE SOLVED: To reduce a switching noise in an integrated circuit without reducing the effectiveness of a heat sink/spreader used along with the integrated circuit. SOLUTION: A device comprises an integrated circuit 510 and one or more decoupling capacitors 540 externally connected to the integrated circuit 510. The decoupling capacitor 540 is arranged in one or more hot spots 520 and 521 in the integrated circuit 510 so as to have a higher concentration. COPYRIGHT: (C)2007,JPO&INPIT</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2006</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAgMjgwOcfVVcPRzUfB1DfHwd1Fw8w9SCHJ1CXX29HNXCPb0DfUJcfRz9Q8NVggO9wxx9gAJ-_l7BrsqePoBUYire5BjiKuLgrNnkHOoZwgPA2taYk5xKi-U5mZQcnMFatNNLciPTy0uSExOzUstifcKMDIwMDOyNDW0NHY0JkoRACGFMA8</recordid><startdate>20061026</startdate><enddate>20061026</enddate><creator>HOSOMI HIDEKAZU</creator><creator>PAUL HARVEY</creator><scope>EVB</scope></search><sort><creationdate>20061026</creationdate><title>SYSTEM AND METHOD FOR REDUCING SIMULTANEOUS SWITCHING NOISE IN INTEGRATED CIRCUIT</title><author>HOSOMI HIDEKAZU ; PAUL HARVEY</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2006295193A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2006</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>HOSOMI HIDEKAZU</creatorcontrib><creatorcontrib>PAUL HARVEY</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HOSOMI HIDEKAZU</au><au>PAUL HARVEY</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SYSTEM AND METHOD FOR REDUCING SIMULTANEOUS SWITCHING NOISE IN INTEGRATED CIRCUIT</title><date>2006-10-26</date><risdate>2006</risdate><abstract>PROBLEM TO BE SOLVED: To reduce a switching noise in an integrated circuit without reducing the effectiveness of a heat sink/spreader used along with the integrated circuit. SOLUTION: A device comprises an integrated circuit 510 and one or more decoupling capacitors 540 externally connected to the integrated circuit 510. The decoupling capacitor 540 is arranged in one or more hot spots 520 and 521 in the integrated circuit 510 so as to have a higher concentration. COPYRIGHT: (C)2007,JPO&INPIT</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_JP2006295193A |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | SYSTEM AND METHOD FOR REDUCING SIMULTANEOUS SWITCHING NOISE IN INTEGRATED CIRCUIT |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-12T22%3A45%3A47IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=HOSOMI%20HIDEKAZU&rft.date=2006-10-26&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2006295193A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |