METHOD AND DEVICE FOR MANUFACTURING ELECTRONIC PART PACKAGE

METHOD AND DEVICE FOR MANUFACTURING ELECTRONIC PART PACKAGE

PROBLEM TO BE SOLVED: To provide a method and device for efficiently manufacturing an electronic part package configured by sealing electronic parts or compact circuits in a package. SOLUTION: The method for manufacturing the electronic part package comprises a step for each accommodating parts in c...

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Hauptverfasser: SUZUKI TAKAYUKI, SHOGETSU YUTAKA
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator SUZUKI TAKAYUKI
SHOGETSU YUTAKA
description PROBLEM TO BE SOLVED: To provide a method and device for efficiently manufacturing an electronic part package configured by sealing electronic parts or compact circuits in a package. SOLUTION: The method for manufacturing the electronic part package comprises a step for each accommodating parts in cavities for accommodating parts of a sheeted package aggregate, before being divided into individual electronic part packages to conduct a predetermined electrical connection therebetween; a step for contacting thin plates with mesh surfaces of meshed partition sections where the cavities of the sheeted package aggregate are formed with an atmospheric difference or the like; a step for irradiating thermal beam to the thin plates to weld the thin plates onto the mesh surfaces in vacuum or an electrically insulative gas; and a step for separating the sheeted package aggregate from the thin plates welded thereto at the meshed partition sections to obtain individual electronic parts. COPYRIGHT: (C)2007,JPO&INPIT
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title METHOD AND DEVICE FOR MANUFACTURING ELECTRONIC PART PACKAGE
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