MANUFACTURING METHOD OF GREEN SUBSTRATE, BREAKING METHOD OF CERAMIC SUBSTRATE, AND MANUFACTURING METHOD OF CHIP ELECTRIC COMPONENT

MANUFACTURING METHOD OF GREEN SUBSTRATE, BREAKING METHOD OF CERAMIC SUBSTRATE, AND MANUFACTURING METHOD OF CHIP ELECTRIC COMPONENT

PROBLEM TO BE SOLVED: To provide a manufacturing method of a green substrate, a breaking method of a ceramic substrate, and a manufacturing method of a chip electric component whereby a substrate itself with a comparatively large area can be handled before baking and during baking, so as to provide...

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Hauptverfasser: SHIOTANI KATSUHIKO, SATO REI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CAPACITORS
CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
ELECTRICITY
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creator SHIOTANI KATSUHIKO
SATO REI
description PROBLEM TO BE SOLVED: To provide a manufacturing method of a green substrate, a breaking method of a ceramic substrate, and a manufacturing method of a chip electric component whereby a substrate itself with a comparatively large area can be handled before baking and during baking, so as to provide excellent handling without causing a tilt breaking face or the like after baking, the substrate can easily be broken into chip electric components, the cutting blade is hardly damaged, and an excellent manufacturing efficiency is provided. SOLUTION: The manufacturing method manufactures the green substrate 2 before baking formed with snap lines 12, 14 not completely breaking the green substrate 2 before baking and acting like snap lines 12, 14 along which individual chip electronic components 10 after baking are broken. The manufacturing method employs the cutting blade 20 the blade tip of which has an projected/recessed uneven pattern with repetition comprising recesses 32 and projections 34 alternately along the lengthwise direction and the cutting blade 20 bites into the green substrate 2 so as to form uneven cuts whose depth differs onto the green substrate 2 along the lengthwise direction of the snap lines 12, 14 without completely breaking the green substrate 2 before baking. COPYRIGHT: (C)2007,JPO&INPIT
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SOLUTION: The manufacturing method manufactures the green substrate 2 before baking formed with snap lines 12, 14 not completely breaking the green substrate 2 before baking and acting like snap lines 12, 14 along which individual chip electronic components 10 after baking are broken. The manufacturing method employs the cutting blade 20 the blade tip of which has an projected/recessed uneven pattern with repetition comprising recesses 32 and projections 34 alternately along the lengthwise direction and the cutting blade 20 bites into the green substrate 2 so as to form uneven cuts whose depth differs onto the green substrate 2 along the lengthwise direction of the snap lines 12, 14 without completely breaking the green substrate 2 before baking. 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subjects BASIC ELECTRIC ELEMENTS
CAPACITORS
CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
ELECTRICITY
title MANUFACTURING METHOD OF GREEN SUBSTRATE, BREAKING METHOD OF CERAMIC SUBSTRATE, AND MANUFACTURING METHOD OF CHIP ELECTRIC COMPONENT
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