CERAMIC CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED: To provide a ceramic circuit board for controlling the formation of a fine uneven surface in the plane direction of the side end of wiring by enhancing a resolution of a fine wiring conductor, and also to provide a manufacturing method for easily obtaining in lower cost the same ceramic circuit board for controlling the formation of fine uneven surface in the plane direction of the side end of the wiring by enhancing the resolution of the fine wiring conductor. SOLUTION: The ceramic circuit board comprises a laminated body formed by laminating a plurality of insulating layers formed of ceramic and a wiring conductor formed on the surface and/or internal side of the insulating layer. When the wiring conductor is projected to the surface of the insulating layer for the surface depth δ of the electromagnetic wave passing through the wiring conductor, the number of projected and recessed regions with depths over 3δ existing at the boundary between the wiring conductor and the insulating layer is equal to five or less for a distance of 30δ in the longitudinal direction. COPYRIGHT: (C)2006,JPO&NCIPI