SEMICONDUCTOR CHIP AND SEMICONDUCTOR APPARATUS WITH SEMICONDUCTOR CHIP MOUNTED THEREON

PROBLEM TO BE SOLVED: To use chips in common having different carrying packages though a main function is the same. SOLUTION: A semiconductor chip includes a plurality of pads, an input circuit or an output circuit connected electrically with the pad, a product information containment unit which sto...

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Hauptverfasser: NAKATSU SHINICHI, NISHIZAWA KAZUYUKI, ISOGAI HIDEO, ETO KIMIHARU, TSUBOI TOSHIHIDE, MASUMOTO NAGAHIRO
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creator NAKATSU SHINICHI
NISHIZAWA KAZUYUKI
ISOGAI HIDEO
ETO KIMIHARU
TSUBOI TOSHIHIDE
MASUMOTO NAGAHIRO
description PROBLEM TO BE SOLVED: To use chips in common having different carrying packages though a main function is the same. SOLUTION: A semiconductor chip includes a plurality of pads, an input circuit or an output circuit connected electrically with the pad, a product information containment unit which stores product information, and a setting unit. The setting unit makes an input circuit or output circuit connected with the pad with which an external signal is impressed electrically into an active state, and an input circuit or output circuit electrically connected to the pad with which an external signal is not impressed is made into non-active state based on the product information. This product information includes the information showing the number of the external pins mounted in the package on which the semiconductor chip is mounted. It does in this way, it becomes possible to match an internal circuitry with the external pin of the distinct package, and it becomes possible to attain the common utilization of the chip. COPYRIGHT: (C)2006,JPO&NCIPI
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title SEMICONDUCTOR CHIP AND SEMICONDUCTOR APPARATUS WITH SEMICONDUCTOR CHIP MOUNTED THEREON
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