METHOD OF MANUFACTURING WIRING CIRCUIT BOARD

METHOD OF MANUFACTURING WIRING CIRCUIT BOARD

PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring circuit board capable of manufacturing a wiring circuit board having less blur and warpage, irrespective of miniaturization of the wiring circuit board and fineness of a conductor pattern. SOLUTION: A plurality of wiring circuit ele...

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1. Verfasser: AONUMA HIDENORI
Format: Patent
Sprache:eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator AONUMA HIDENORI
description PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring circuit board capable of manufacturing a wiring circuit board having less blur and warpage, irrespective of miniaturization of the wiring circuit board and fineness of a conductor pattern. SOLUTION: A plurality of wiring circuit elements 10 are produced with a plurality of base insulating layers 3, conductor patterns 4, and cover insulating layers 8 sequentially formed therein on a metal supporting sheet 2 with intervals in a lineup state, and a wiring circuit board printed sheet 9 is acquired. Subsequently, etching resists 11 are formed so as to sandwich the sheet 9 in a state where one of them continues between each wiring circuit board 1, and the other is formed such that the peripheral part corresponding to the outer shape of the each wiring circuit board 1 on the metal supporting sheet 2 is exposed, and then, the external periphery exposed from the etching resist 11 is etched. After that, the etching resist 11 is peeled off in a state where the etching resist 11 is sandwiched by a mesh plate 13. COPYRIGHT: (C)2006,JPO&NCIPI
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title METHOD OF MANUFACTURING WIRING CIRCUIT BOARD
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