WIRING BOARD

PROBLEM TO BE SOLVED: To provide a wiring board in which adhesion between a board body composed of glass-ceramic and a Cu metallized layer formed to the board body is enhanced, and mounting strength of a conductor pin brazed to the Cu metallized layer is improved. SOLUTION: The wiring board 1 includes the board body 2 which is composed of glass-ceramic and has the surface 3 and the rear face 4, a Cu-ceramic mixed layer 20 which is formed to the rear face 4 of the board body 2 and composed by mixing Cu powder with ceramic powder, the Cu metallized layer 22 formed on the Cu-ceramic mixed layer 20, and the conductor pin 26 erected above the Cu metallized layer 22 via a brazing filler metal 23 having a melting point of ≥500 °C. COPYRIGHT: (C)2006,JPO&NCIPI