FILM DEPOSITION APPARATUS AND FILM DEPOSITION METHOD
PROBLEM TO BE SOLVED: To provide a film deposition apparatus and a film deposition method which enable pre-treatment such as pre-sputtering in a vacuum vessel to be performed without arranging complicated shutter mechanism. SOLUTION: The film deposition apparatus performs film deposition in such a m...
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creator | YAMANISHI HITOSHI MORI SATOSHI SUEMITSU TOSHIYUKI NAKAJIMA SEIJI OKUMA TAKAFUMI |
description | PROBLEM TO BE SOLVED: To provide a film deposition apparatus and a film deposition method which enable pre-treatment such as pre-sputtering in a vacuum vessel to be performed without arranging complicated shutter mechanism. SOLUTION: The film deposition apparatus performs film deposition in such a manner that a plurality of trays 4 are shifted in order to each of the plurality of vacuum vessels 1 connected in series and film-depositing treatment is applied to a work 6 held with the tray 4 in each vacuum vessel 1, wherein each of the plurality of trays 4 has constitution having, in at least the end parts, projecting parts 10 functioning as blocking parts for holding a prescribed atmosphere in the vacuum vessel 1 with conductance by blocking opening holes 2a disposed at both end parts of the vessel so as to leave a gap permissible to pass the tray 4 itself therethrough when the tray is set at a prescribed film-depositing position in each vacuum vessel 1. Some trays among the plurality of trays 4 are used as dummy trays 4b which do not convey the work 6, and the pre-deposition treatment is performed in the vacuum vessel 1 into which the dummy tray 4b is shifted. The individual atmosphere can be held in each vacuum vessel 1 by hermetically sealing the vacuum vessel with the tray 4 itself functioning as the shut-off means. COPYRIGHT: (C)2006,JPO&NCIPI |
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fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2006161095A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2006161095A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2006161095A3</originalsourceid><addsrcrecordid>eNrjZDBx8_TxVXBxDfAP9gzx9PdTcAwIcAxyDAkNVnD0c1FAl_V1DfHwd-FhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGBmaGZoYGlqaOxkQpAgAZzSfc</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>FILM DEPOSITION APPARATUS AND FILM DEPOSITION METHOD</title><source>esp@cenet</source><creator>YAMANISHI HITOSHI ; MORI SATOSHI ; SUEMITSU TOSHIYUKI ; NAKAJIMA SEIJI ; OKUMA TAKAFUMI</creator><creatorcontrib>YAMANISHI HITOSHI ; MORI SATOSHI ; SUEMITSU TOSHIYUKI ; NAKAJIMA SEIJI ; OKUMA TAKAFUMI</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a film deposition apparatus and a film deposition method which enable pre-treatment such as pre-sputtering in a vacuum vessel to be performed without arranging complicated shutter mechanism. SOLUTION: The film deposition apparatus performs film deposition in such a manner that a plurality of trays 4 are shifted in order to each of the plurality of vacuum vessels 1 connected in series and film-depositing treatment is applied to a work 6 held with the tray 4 in each vacuum vessel 1, wherein each of the plurality of trays 4 has constitution having, in at least the end parts, projecting parts 10 functioning as blocking parts for holding a prescribed atmosphere in the vacuum vessel 1 with conductance by blocking opening holes 2a disposed at both end parts of the vessel so as to leave a gap permissible to pass the tray 4 itself therethrough when the tray is set at a prescribed film-depositing position in each vacuum vessel 1. Some trays among the plurality of trays 4 are used as dummy trays 4b which do not convey the work 6, and the pre-deposition treatment is performed in the vacuum vessel 1 into which the dummy tray 4b is shifted. The individual atmosphere can be held in each vacuum vessel 1 by hermetically sealing the vacuum vessel with the tray 4 itself functioning as the shut-off means. COPYRIGHT: (C)2006,JPO&NCIPI</description><language>eng</language><subject>CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2006</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20060622&DB=EPODOC&CC=JP&NR=2006161095A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20060622&DB=EPODOC&CC=JP&NR=2006161095A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YAMANISHI HITOSHI</creatorcontrib><creatorcontrib>MORI SATOSHI</creatorcontrib><creatorcontrib>SUEMITSU TOSHIYUKI</creatorcontrib><creatorcontrib>NAKAJIMA SEIJI</creatorcontrib><creatorcontrib>OKUMA TAKAFUMI</creatorcontrib><title>FILM DEPOSITION APPARATUS AND FILM DEPOSITION METHOD</title><description>PROBLEM TO BE SOLVED: To provide a film deposition apparatus and a film deposition method which enable pre-treatment such as pre-sputtering in a vacuum vessel to be performed without arranging complicated shutter mechanism. SOLUTION: The film deposition apparatus performs film deposition in such a manner that a plurality of trays 4 are shifted in order to each of the plurality of vacuum vessels 1 connected in series and film-depositing treatment is applied to a work 6 held with the tray 4 in each vacuum vessel 1, wherein each of the plurality of trays 4 has constitution having, in at least the end parts, projecting parts 10 functioning as blocking parts for holding a prescribed atmosphere in the vacuum vessel 1 with conductance by blocking opening holes 2a disposed at both end parts of the vessel so as to leave a gap permissible to pass the tray 4 itself therethrough when the tray is set at a prescribed film-depositing position in each vacuum vessel 1. Some trays among the plurality of trays 4 are used as dummy trays 4b which do not convey the work 6, and the pre-deposition treatment is performed in the vacuum vessel 1 into which the dummy tray 4b is shifted. The individual atmosphere can be held in each vacuum vessel 1 by hermetically sealing the vacuum vessel with the tray 4 itself functioning as the shut-off means. COPYRIGHT: (C)2006,JPO&NCIPI</description><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2006</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDBx8_TxVXBxDfAP9gzx9PdTcAwIcAxyDAkNVnD0c1FAl_V1DfHwd-FhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGBmaGZoYGlqaOxkQpAgAZzSfc</recordid><startdate>20060622</startdate><enddate>20060622</enddate><creator>YAMANISHI HITOSHI</creator><creator>MORI SATOSHI</creator><creator>SUEMITSU TOSHIYUKI</creator><creator>NAKAJIMA SEIJI</creator><creator>OKUMA TAKAFUMI</creator><scope>EVB</scope></search><sort><creationdate>20060622</creationdate><title>FILM DEPOSITION APPARATUS AND FILM DEPOSITION METHOD</title><author>YAMANISHI HITOSHI ; MORI SATOSHI ; SUEMITSU TOSHIYUKI ; NAKAJIMA SEIJI ; OKUMA TAKAFUMI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2006161095A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2006</creationdate><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>YAMANISHI HITOSHI</creatorcontrib><creatorcontrib>MORI SATOSHI</creatorcontrib><creatorcontrib>SUEMITSU TOSHIYUKI</creatorcontrib><creatorcontrib>NAKAJIMA SEIJI</creatorcontrib><creatorcontrib>OKUMA TAKAFUMI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YAMANISHI HITOSHI</au><au>MORI SATOSHI</au><au>SUEMITSU TOSHIYUKI</au><au>NAKAJIMA SEIJI</au><au>OKUMA TAKAFUMI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>FILM DEPOSITION APPARATUS AND FILM DEPOSITION METHOD</title><date>2006-06-22</date><risdate>2006</risdate><abstract>PROBLEM TO BE SOLVED: To provide a film deposition apparatus and a film deposition method which enable pre-treatment such as pre-sputtering in a vacuum vessel to be performed without arranging complicated shutter mechanism. SOLUTION: The film deposition apparatus performs film deposition in such a manner that a plurality of trays 4 are shifted in order to each of the plurality of vacuum vessels 1 connected in series and film-depositing treatment is applied to a work 6 held with the tray 4 in each vacuum vessel 1, wherein each of the plurality of trays 4 has constitution having, in at least the end parts, projecting parts 10 functioning as blocking parts for holding a prescribed atmosphere in the vacuum vessel 1 with conductance by blocking opening holes 2a disposed at both end parts of the vessel so as to leave a gap permissible to pass the tray 4 itself therethrough when the tray is set at a prescribed film-depositing position in each vacuum vessel 1. Some trays among the plurality of trays 4 are used as dummy trays 4b which do not convey the work 6, and the pre-deposition treatment is performed in the vacuum vessel 1 into which the dummy tray 4b is shifted. The individual atmosphere can be held in each vacuum vessel 1 by hermetically sealing the vacuum vessel with the tray 4 itself functioning as the shut-off means. COPYRIGHT: (C)2006,JPO&NCIPI</abstract><oa>free_for_read</oa></addata></record> |
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subjects | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
title | FILM DEPOSITION APPARATUS AND FILM DEPOSITION METHOD |
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