PATTERNING METHOD AND PROCESS FOR MANUFACTURING INK JET RECORDING HEAD

PROBLEM TO BE SOLVED: To provide a patterning method in which the wall face at a recess in a pattern can be tapered while sustaining a sharp edge at the opening of the pattern even if the pattern is formed by photolithography, and to provide a process for manufacturing an ink jet recording head by a...

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Bibliographische Detailangaben
Hauptverfasser: ONO NORIYUKI, FUKUDA MAKI, UEDA HIKARI, OKUMA NORIO, OSUMI MASANORI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a patterning method in which the wall face at a recess in a pattern can be tapered while sustaining a sharp edge at the opening of the pattern even if the pattern is formed by photolithography, and to provide a process for manufacturing an ink jet recording head by applying that method. SOLUTION: The patterning method comprises a step for forming a coating resin layer containing a photopolymerizable resin, a step for forming a distribution of photopolymerization initiator concentration in the film thickness direction of the coating resin layer by applying solution containing the photopolymerization initiator onto the coating resin layer, a step for irradiating the coating resin layer with light from above through a patterned mask, and a step for obtaining a patterned coating resin layer by developing the coating resin layer irradiated with light. This method is applied to manufacture of an ink jet recording head. COPYRIGHT: (C)2006,JPO&NCIPI