CHIPPING-RESISTANT TRANSPARENT COATING FILM AND FORMING METHOD THEREFOR
PROBLEM TO BE SOLVED: To prepare a chipping-resistant transparent coating film which allows utilization of the color, as it is, of an underlying formed by applying an environment-friendly water-dispersion-type transparent coating material with a sufficient thickness, is energy-saving by low-temperat...
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creator | SHIBATA SEISHI HANABUSA SHINICHI |
description | PROBLEM TO BE SOLVED: To prepare a chipping-resistant transparent coating film which allows utilization of the color, as it is, of an underlying formed by applying an environment-friendly water-dispersion-type transparent coating material with a sufficient thickness, is energy-saving by low-temperature drying and readily dried by humidification and achieves sufficient chipping resistance. SOLUTION: The subject method comprises preparing the chipping-resistant transparent coating film by mixing 100 pts.wt. of a urethane dispersion as a water-dispersed resin A with 10 pts.wt. of a polyisocyanate imparted with nonionic hydrophilic groups as a water-dispersible isocyanate B and 1 pt.wt. of a urethane-modified polyether compound as a thickener C, applying the resultant coating material to a film thickness of about 500 μm, drying it at low temperatures between about 50°C and about 60°C for about 10 min and humidifying at humidities of 80%±5% for about 10 min. When the average number of functional groups of B is set to be ≥2.5, and the number (n) of the alkyl group, CnH2n+1, in the side chain to be ≥5, the chipping-resistant transparent coating film obtained is transparent and excellent in the appearance of the coated surface, the adhesion of the over coating, chipping resistance and water whitening resistance. COPYRIGHT: (C)2006,JPO&NCIPI |
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SOLUTION: The subject method comprises preparing the chipping-resistant transparent coating film by mixing 100 pts.wt. of a urethane dispersion as a water-dispersed resin A with 10 pts.wt. of a polyisocyanate imparted with nonionic hydrophilic groups as a water-dispersible isocyanate B and 1 pt.wt. of a urethane-modified polyether compound as a thickener C, applying the resultant coating material to a film thickness of about 500 μm, drying it at low temperatures between about 50°C and about 60°C for about 10 min and humidifying at humidities of 80%±5% for about 10 min. When the average number of functional groups of B is set to be ≥2.5, and the number (n) of the alkyl group, CnH2n+1, in the side chain to be ≥5, the chipping-resistant transparent coating film obtained is transparent and excellent in the appearance of the coated surface, the adhesion of the over coating, chipping resistance and water whitening resistance. 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SOLUTION: The subject method comprises preparing the chipping-resistant transparent coating film by mixing 100 pts.wt. of a urethane dispersion as a water-dispersed resin A with 10 pts.wt. of a polyisocyanate imparted with nonionic hydrophilic groups as a water-dispersible isocyanate B and 1 pt.wt. of a urethane-modified polyether compound as a thickener C, applying the resultant coating material to a film thickness of about 500 μm, drying it at low temperatures between about 50°C and about 60°C for about 10 min and humidifying at humidities of 80%±5% for about 10 min. When the average number of functional groups of B is set to be ≥2.5, and the number (n) of the alkyl group, CnH2n+1, in the side chain to be ≥5, the chipping-resistant transparent coating film obtained is transparent and excellent in the appearance of the coated surface, the adhesion of the over coating, chipping resistance and water whitening resistance. COPYRIGHT: (C)2006,JPO&NCIPI</description><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</subject><subject>PERFORMING OPERATIONS</subject><subject>PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</subject><subject>SPRAYING OR ATOMISING IN GENERAL</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2006</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHB39vAMCPD0c9cNcg32DA5x9AtRCAly9AsOcAxyBbKd_R1DgLIKbp4-vgqOfi4Kbv5BviABX9cQD38XhRAP1yBXoBgPA2taYk5xKi-U5mZQcnMNcfbQTS3Ij08tLkhMTs1LLYn3CjAyMDAzNDYztzRyNCZKEQBYPS1K</recordid><startdate>20060601</startdate><enddate>20060601</enddate><creator>SHIBATA SEISHI</creator><creator>HANABUSA SHINICHI</creator><scope>EVB</scope></search><sort><creationdate>20060601</creationdate><title>CHIPPING-RESISTANT TRANSPARENT COATING FILM AND FORMING METHOD THEREFOR</title><author>SHIBATA SEISHI ; HANABUSA SHINICHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2006136792A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2006</creationdate><topic>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</topic><topic>PERFORMING OPERATIONS</topic><topic>PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</topic><topic>SPRAYING OR ATOMISING IN GENERAL</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>SHIBATA SEISHI</creatorcontrib><creatorcontrib>HANABUSA SHINICHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SHIBATA SEISHI</au><au>HANABUSA SHINICHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CHIPPING-RESISTANT TRANSPARENT COATING FILM AND FORMING METHOD THEREFOR</title><date>2006-06-01</date><risdate>2006</risdate><abstract>PROBLEM TO BE SOLVED: To prepare a chipping-resistant transparent coating film which allows utilization of the color, as it is, of an underlying formed by applying an environment-friendly water-dispersion-type transparent coating material with a sufficient thickness, is energy-saving by low-temperature drying and readily dried by humidification and achieves sufficient chipping resistance. SOLUTION: The subject method comprises preparing the chipping-resistant transparent coating film by mixing 100 pts.wt. of a urethane dispersion as a water-dispersed resin A with 10 pts.wt. of a polyisocyanate imparted with nonionic hydrophilic groups as a water-dispersible isocyanate B and 1 pt.wt. of a urethane-modified polyether compound as a thickener C, applying the resultant coating material to a film thickness of about 500 μm, drying it at low temperatures between about 50°C and about 60°C for about 10 min and humidifying at humidities of 80%±5% for about 10 min. When the average number of functional groups of B is set to be ≥2.5, and the number (n) of the alkyl group, CnH2n+1, in the side chain to be ≥5, the chipping-resistant transparent coating film obtained is transparent and excellent in the appearance of the coated surface, the adhesion of the over coating, chipping resistance and water whitening resistance. COPYRIGHT: (C)2006,JPO&NCIPI</abstract><oa>free_for_read</oa></addata></record> |
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subjects | APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL PERFORMING OPERATIONS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SPRAYING OR ATOMISING IN GENERAL TRANSPORTING |
title | CHIPPING-RESISTANT TRANSPARENT COATING FILM AND FORMING METHOD THEREFOR |
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