BLISTER PACKAGING MATERIAL

PROBLEM TO BE SOLVED: To provide a blister packaging material that can be manufactured rationally and economically while a goods specification is printed directly at the blister packaging material, the goods specification is not required to be additionally attached and there is no possibility that t...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: NAKADA SAYURI, MITSUHASHI TOMONORI, HOSOKAWA KAZUHIKO, YAMAGATA KAZUNORI, TSUJI KENJI, FUJII SATOSHI
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a blister packaging material that can be manufactured rationally and economically while a goods specification is printed directly at the blister packaging material, the goods specification is not required to be additionally attached and there is no possibility that the goods specification is lost. SOLUTION: This blister packaging material is characterized in that its base paper has a flap comprised of a synthetic resin film at its front surface, a synthetic resin film at its rear surface and a synthetic resin film covering the synthetic resin film at the rear surface and has both side edges melted and cut, the flap is provided with some letters and/or patterns that can be acknowledged from its outer surface and with some letters and/or patterns that can be acknowledged from its inner surface, and the blister part having a flange at its circumferential edge is adhered to the synthetic resin film at its front surface with the flange at the surface of the base paper. COPYRIGHT: (C)2006,JPO&NCIPI