LOW-TEMPERATURE FIRED CERAMIC CIRCUIT SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To enhance productivity without impairing the electrical characteristics, such as wire bondability in manufacturing a low-temperature fired ceramic circuit substrate with constrained firing. SOLUTION: On the upper face of the uppermost layer formed of a low-temperature fired ce...

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Hauptverfasser:	FUKAYA MASASHI, FUKUDA JUNZO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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