LOW-TEMPERATURE FIRED CERAMIC CIRCUIT SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
PROBLEM TO BE SOLVED: To enhance productivity without impairing the electrical characteristics, such as wire bondability in manufacturing a low-temperature fired ceramic circuit substrate with constrained firing. SOLUTION: On the upper face of the uppermost layer formed of a low-temperature fired ce...
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| creator | FUKAYA MASASHI FUKUDA JUNZO |
| description | PROBLEM TO BE SOLVED: To enhance productivity without impairing the electrical characteristics, such as wire bondability in manufacturing a low-temperature fired ceramic circuit substrate with constrained firing. SOLUTION: On the upper face of the uppermost layer formed of a low-temperature fired ceramic layer 11, Ag-based conductors 15, 16 for gold-wire/aluminum-wire bonding pads are printed with an Ag-based conductor paste. On the lower face of the lowermost layer formed of the low-temperature fired ceramic layer 11, Ag-based conductors 17 for thick-film-resistor connecting terminals are printed with the same Ag-based conductor paste. Both the layers of the low-temperature fired ceramic layer 11 are stacked and compressed to a substrate 10, and fired in constrained manner, while alumina green sheets 18 are compressed on the both faces. Then, the substrate 10 and the Ag-based conductors 15 to 17 are fired simultaneously. After the firing, the remainders of the alumina green sheets 18 that remain on both the faces of the substrate 10 are removed by polishing or the like, and Ni/Au plated cover films 20, 21 are formed on the surface of the Ag-based conductors 15, 16 for wire-bonding pads through electroless plating. COPYRIGHT: (C)2006,JPO&NCIPI |
| format | Patent |
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SOLUTION: On the upper face of the uppermost layer formed of a low-temperature fired ceramic layer 11, Ag-based conductors 15, 16 for gold-wire/aluminum-wire bonding pads are printed with an Ag-based conductor paste. On the lower face of the lowermost layer formed of the low-temperature fired ceramic layer 11, Ag-based conductors 17 for thick-film-resistor connecting terminals are printed with the same Ag-based conductor paste. Both the layers of the low-temperature fired ceramic layer 11 are stacked and compressed to a substrate 10, and fired in constrained manner, while alumina green sheets 18 are compressed on the both faces. Then, the substrate 10 and the Ag-based conductors 15 to 17 are fired simultaneously. After the firing, the remainders of the alumina green sheets 18 that remain on both the faces of the substrate 10 are removed by polishing or the like, and Ni/Au plated cover films 20, 21 are formed on the surface of the Ag-based conductors 15, 16 for wire-bonding pads through electroless plating. 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SOLUTION: On the upper face of the uppermost layer formed of a low-temperature fired ceramic layer 11, Ag-based conductors 15, 16 for gold-wire/aluminum-wire bonding pads are printed with an Ag-based conductor paste. On the lower face of the lowermost layer formed of the low-temperature fired ceramic layer 11, Ag-based conductors 17 for thick-film-resistor connecting terminals are printed with the same Ag-based conductor paste. Both the layers of the low-temperature fired ceramic layer 11 are stacked and compressed to a substrate 10, and fired in constrained manner, while alumina green sheets 18 are compressed on the both faces. Then, the substrate 10 and the Ag-based conductors 15 to 17 are fired simultaneously. After the firing, the remainders of the alumina green sheets 18 that remain on both the faces of the substrate 10 are removed by polishing or the like, and Ni/Au plated cover films 20, 21 are formed on the surface of the Ag-based conductors 15, 16 for wire-bonding pads through electroless plating. COPYRIGHT: (C)2006,JPO&NCIPI</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | LOW-TEMPERATURE FIRED CERAMIC CIRCUIT SUBSTRATE AND METHOD OF MANUFACTURING THE SAME |
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