DEVICE AND METHOD FOR WAFER LEVEL BURN-IN

PROBLEM TO BE SOLVED: To provide a wafer level burn-in device and a wafer level burn-in method for preventing a probe from being exhausted and burned, by reducing an electric load applied to a wafer simultaneously and suppressing the transitional rise of the temperature of the wafer. SOLUTION: The w...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TERANISHI MASATOSHI, SEGAWA AKITSUGU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS SEMICONDUCTOR DEVICES TESTING
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