INTEGRATED CIRCUIT DEVICE

PROBLEM TO BE SOLVED: To provide an integrated circuit device which can suitably increase flexibility concerning the design by securing fully electronic-parts mounting area E on a heat sink 1 while maintaining stably the jointing condition of the heat sink 1 and a lead frame. SOLUTION: A resin mold is carried out integrally to electronic parts and the heat sink 1 in such a state that a part forming the inner lead of a lead frame is connected electrically with electronic parts constituting an integrated circuit, while the electronic parts constituting an integrated circuit device are mounted on the upper surface of the heat sink 1 connected to the lead frame. The lead frame comprises two connection pieces 13 connected to the heat sink 1, and two support leads 14 extended to the inner direction of the heat sink 1 as a dummy inner lead and brought into contact with the heat sink 1. The heat sink 1 is supported by the lead frame in collaboration with the connection to the connection pieces 13 and the contact with the support leads 14. COPYRIGHT: (C)2006,JPO&NCIPI