PACKAGE FOR HOUSING ELECTRIC ELEMENT, ELECTRIC ELEMENT UNIT AND ELECTRIC ELEMENT COOLING MODULE

PROBLEM TO BE SOLVED: To provide a package for housing an electric element having a high heat sink property and reliability, and to provide an electric element unit and an electric element cooling module. SOLUTION: The package 14 for housing the electric element includes an electric element storing...

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Hauptverfasser: TERASONO HIROBUMI, ITO NOBUYUKI, YAKUBO KIYOSHI, TERAO SHINYA
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a package for housing an electric element having a high heat sink property and reliability, and to provide an electric element unit and an electric element cooling module. SOLUTION: The package 14 for housing the electric element includes an electric element storing container 16 for housing the electric element 15 which is formed into an approximately rectangular parallelepiped shape and in which a part except the upper surface 16a is formed into a watertight structure, and an electrode 17 arranged on the inner surface of the electric storing container 16. At least the part of the electric element storing container 16 is the package 14 for housing the electric element made of a ceramic substrate having a Young's modulus of 340 GPa or less. COPYRIGHT: (C)2006,JPO&NCIPI